ee:soldering
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| ee:soldering [2025/03/14 13:21] – FKR@staff.hsrw | ee:soldering [2025/11/13 08:34] (current) – FKR@staff.hsrw | ||
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| * A good heat transfer between the tip of the soldering iron and the component and pad on the PCB is important. Liquid solder will enable a good heat transfer. | * A good heat transfer between the tip of the soldering iron and the component and pad on the PCB is important. Liquid solder will enable a good heat transfer. | ||
| * Keep the tip at the soldering joint until the solder has moved where it is supposed to be. In a good (THT) soldering joint the solder will form a cone (not a ball) on both sides of the PCB. The solder should at least be visible from the other side of the PCB. | * Keep the tip at the soldering joint until the solder has moved where it is supposed to be. In a good (THT) soldering joint the solder will form a cone (not a ball) on both sides of the PCB. The solder should at least be visible from the other side of the PCB. | ||
| - | | + | * Cut off the protruding wires of the components **before** you solder. Cutting them off after soldering puts too much stress on the joint. |
| - | | + | |
| * Do not use too much solder. The joint should have a cone shape (as mentioned before) and the wire of the components should still be visible. | * Do not use too much solder. The joint should have a cone shape (as mentioned before) and the wire of the components should still be visible. | ||
| * Use a bending help for small axial components (like resistors). | * Use a bending help for small axial components (like resistors). | ||
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| * Preheat the PCB to 100-120°C using the IR preheater. | * Preheat the PCB to 100-120°C using the IR preheater. | ||
| * Wait and check the temperature fo the PCB using the IR thermometer. | * Wait and check the temperature fo the PCB using the IR thermometer. | ||
| - | * Use a standard soldering iron to solder. As the temperature difference is now smaller, soldering with thick ground | + | * Use a standard soldering iron to solder. As the temperature difference is now smaller, soldering with thick ground |
| * Alternatively you can use a hot air gun to preheat the PCB locally. | * Alternatively you can use a hot air gun to preheat the PCB locally. | ||
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| ==== Contact soldering ==== | ==== Contact soldering ==== | ||
| - | Contact soldering (i.e. with soldering iron) of SMD components is most commonly done in repair-work. Usually only a few compoents | + | Contact soldering (i.e. with soldering iron) of SMD components is most commonly done in repair-work. Usually only a few components |
| The choice of tip for your soldering iron becomes more important. Chisel-shaped tips are still preferred over conical tips, however you might want to use smaller tips or conical tips for fine pitched but multi-pin components. | The choice of tip for your soldering iron becomes more important. Chisel-shaped tips are still preferred over conical tips, however you might want to use smaller tips or conical tips for fine pitched but multi-pin components. | ||
| - | In addition to the normal tips there are tips for flow soldering (german " | + | In addition to the normal tips there are tips for flow soldering (german " |
| - | You can see the flow soldering with a " | + | You can see the flow soldering with a hoof tip in [[https:// |
| - | Generally it is a good idea to apply some soldering wire to a pad first and then use tweezers to move the component in position while you keep to tin liquid using your soldering iron. The compoent | + | Generally it is a good idea to apply some soldering wire to a pad first and then use tweezers to move the component in position while you keep the tin liquid using your soldering iron. The component |
| Specifically for desoldering two pin SMD components we own a set of desoldering tweezers. Basically a toll with two soldering tips. | Specifically for desoldering two pin SMD components we own a set of desoldering tweezers. Basically a toll with two soldering tips. | ||
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| * Place components using tweezers (or the Pick-and-Place maschine) | * Place components using tweezers (or the Pick-and-Place maschine) | ||
| * Small components might need to be held until the tin is liquid. | * Small components might need to be held until the tin is liquid. | ||
| - | * Preheat from a greater | + | * Preheat from a greater |
| * Solder the component using hot air from a distance of 5-20mm (mostly vertical). Use an appropiate nozzle. | * Solder the component using hot air from a distance of 5-20mm (mostly vertical). Use an appropiate nozzle. | ||
| * Stop when wetting is of good quality | * Stop when wetting is of good quality | ||
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| - | ==== Most common problems in hand soldering ==== | + | ==== Most common problems in SMT hand soldering ==== |
| The most common problems from THT still apply. There are two more problems: | The most common problems from THT still apply. There are two more problems: | ||
| * Padlifting: Too much heat can raise the pad from the PCB. | * Padlifting: Too much heat can raise the pad from the PCB. | ||
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| * Leave the components in the bag when moving in the lab. | * Leave the components in the bag when moving in the lab. | ||
| * Use an ESD wristband whenever working with ESD sensitive components. | * Use an ESD wristband whenever working with ESD sensitive components. | ||
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| + | ===== Finepitch/ | ||
ee/soldering.1741958514.txt.gz · Last modified: by FKR@staff.hsrw