ee:soldering
Differences
This shows you the differences between two versions of the page.
| Both sides previous revision Previous revision Next revision | Previous revision | ||
|
ee:soldering [2025/03/18 20:04] FKR@staff.hsrw |
ee:soldering [2025/11/13 09:34] (current) FKR@staff.hsrw |
||
|---|---|---|---|
| Line 88: | Line 88: | ||
| * Preheat the PCB to 100-120°C using the IR preheater. | * Preheat the PCB to 100-120°C using the IR preheater. | ||
| * Wait and check the temperature fo the PCB using the IR thermometer. | * Wait and check the temperature fo the PCB using the IR thermometer. | ||
| - | * Use a standard soldering iron to solder. As the temperature difference is now smaller, soldering with thick ground placnes should be easier. | + | * Use a standard soldering iron to solder. As the temperature difference is now smaller, soldering with thick ground planes should be easier. |
| * Alternatively you can use a hot air gun to preheat the PCB locally. | * Alternatively you can use a hot air gun to preheat the PCB locally. | ||
| Line 119: | Line 119: | ||
| Contact soldering (i.e. with soldering iron) of SMD components is most commonly done in repair-work. Usually only a few components will need to be (de)soldered by hand. Attention: not all components can handle the shock immediate heat from contact soldering (e.g. be careful with ceramic capacitors). | Contact soldering (i.e. with soldering iron) of SMD components is most commonly done in repair-work. Usually only a few components will need to be (de)soldered by hand. Attention: not all components can handle the shock immediate heat from contact soldering (e.g. be careful with ceramic capacitors). | ||
| The choice of tip for your soldering iron becomes more important. Chisel-shaped tips are still preferred over conical tips, however you might want to use smaller tips or conical tips for fine pitched but multi-pin components. | The choice of tip for your soldering iron becomes more important. Chisel-shaped tips are still preferred over conical tips, however you might want to use smaller tips or conical tips for fine pitched but multi-pin components. | ||
| - | In addition to the normal tips there are tips for flow soldering (german "Schwalllöten"). You can use a tip with a "Hohlkehle" which has a small deposit for tin to solder multi-pin components with gullwing connectors (like QFP or SOIC) in a single operation. Similarily there are blade-shaped tips for J-type connectors (PLCC or SOJ). In both cases you will need to use extra flux. The "Hohlkehle" tip is availabe in the lab. | + | In addition to the normal tips there are tips for flow soldering (german "Schwalllöten"). You can use a tip with a hoof (german "Hohlkehle") which has a small deposit for tin to solder multi-pin components with gullwing connectors (like QFP or SOIC) in a single operation. Similarily there are blade-shaped tips for J-type connectors (PLCC or SOJ). In both cases you will need to use extra flux. The "Hohlkehle" tip is availabe in the lab. |
| - | You can see the flow soldering with a "Hohlkehle" tip in [[https://hs-rw.cloud.panopto.eu/Panopto/Pages/Viewer.aspx?id=c5301793-a3d4-4684-913c-b2a000d7e954|this video]]. | + | You can see the flow soldering with a hoof tip in [[https://hs-rw.cloud.panopto.eu/Panopto/Pages/Viewer.aspx?id=c5301793-a3d4-4684-913c-b2a000d7e954|this video]]. |
| Generally it is a good idea to apply some soldering wire to a pad first and then use tweezers to move the component in position while you keep the tin liquid using your soldering iron. The component is now fixed to the PCB and the other pin(s) can be soldered next without the risk of moving (see [[https://hs-rw.cloud.panopto.eu/Panopto/Pages/Viewer.aspx?id=9b16628b-bd9a-4cbb-bb18-b2a000dfabfe|this video]]. For bigger ICs it might be a good stretegy to fix two or three corners first. | Generally it is a good idea to apply some soldering wire to a pad first and then use tweezers to move the component in position while you keep the tin liquid using your soldering iron. The component is now fixed to the PCB and the other pin(s) can be soldered next without the risk of moving (see [[https://hs-rw.cloud.panopto.eu/Panopto/Pages/Viewer.aspx?id=9b16628b-bd9a-4cbb-bb18-b2a000dfabfe|this video]]. For bigger ICs it might be a good stretegy to fix two or three corners first. | ||
| Line 183: | Line 183: | ||
| * Leave the components in the bag when moving in the lab. | * Leave the components in the bag when moving in the lab. | ||
| * Use an ESD wristband whenever working with ESD sensitive components. | * Use an ESD wristband whenever working with ESD sensitive components. | ||
| + | |||
| + | |||
| + | ===== Finepitch/rework ===== | ||
ee/soldering.1742324699.txt.gz · Last modified: 2025/03/18 20:04 by FKR@staff.hsrw
Page Tools
