Differences

This shows you the differences between two versions of the page.

--- ee:soldering [2025/03/25 14:09] – FKR@staff.hsrw
+++ ee:soldering [2025/11/13 08:34] (current) – FKR@staff.hsrw
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 Contact soldering (i.e. with soldering iron) of SMD components is most commonly done in repair-work. Usually only a few components will need to be (de)soldered by hand. Attention: not all components can handle the shock immediate heat from contact soldering (e.g. be careful with ceramic capacitors).
 The choice of tip for your soldering iron becomes more important. Chisel-shaped tips are still preferred over conical tips, however you might want to use smaller tips or conical tips for fine pitched but multi-pin components.
-In addition to the normal tips there are tips for flow soldering (german "Schwalllöten"). You can use a tip with a "Hohlkehle" which has a small deposit for tin to solder multi-pin components with gullwing connectors (like QFP or SOIC) in a single operation. Similarily there are blade-shaped tips for J-type connectors (PLCC or SOJ). In both cases you will need to use extra flux. The "Hohlkehle" tip is availabe in the lab.
+In addition to the normal tips there are tips for flow soldering (german "Schwalllöten"). You can use a tip with a hoof (german "Hohlkehle") which has a small deposit for tin to solder multi-pin components with gullwing connectors (like QFP or SOIC) in a single operation. Similarily there are blade-shaped tips for J-type connectors (PLCC or SOJ). In both cases you will need to use extra flux. The "Hohlkehle" tip is availabe in the lab.
-You can see the flow soldering with a "Hohlkehle" tip in [[https://hs-rw.cloud.panopto.eu/Panopto/Pages/Viewer.aspx?id=c5301793-a3d4-4684-913c-b2a000d7e954|this video]].
+You can see the flow soldering with a hoof tip in [[https://hs-rw.cloud.panopto.eu/Panopto/Pages/Viewer.aspx?id=c5301793-a3d4-4684-913c-b2a000d7e954|this video]].
 Generally it is a good idea to apply some soldering wire to a pad first and then use tweezers to move the component in position while you keep the tin liquid using your soldering iron. The component is now fixed to the PCB and the other pin(s) can be soldered next without the risk of moving (see [[https://hs-rw.cloud.panopto.eu/Panopto/Pages/Viewer.aspx?id=9b16628b-bd9a-4cbb-bb18-b2a000dfabfe|this video]]. For bigger ICs it might be a good stretegy to fix two or three corners first.